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DCP01
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DCP01/50 (50 separated chips), 1190,00 €
DCP01/15 (15 separated chips), 420,00 € |
Coating Specification:
- Thickness of diamond coating is about 100 nm.
- Diamond coating is doped with nitrogen.
- Film resistivity: 0,5-1 Ohm*cm.
- Tip curvature radius after coating is about 100 nm.
- Recommended for electrical modes.
- Specially recommended for Electrical AFM modes (EFM, SCM, SKM, SRM etc).
Probe specification
- Standard chip size: 1.6x3.6x0.4 mm.
- High cemically stable reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
- Typical curvature radius of a tip: 100 nm.
- Tip height: 10 - 15 µm.
- Each chip has one RECTANGULAR spring.
- Compatible with the most commercial SPM devices.
- Silicon is doped by boron with the concentration about 5x1020 cm-3 to avoid electrostatic charges.
- Packaged in GelPak® boxes.
GelPak® is a registered trade mark of Vichem Corporation.
| Specification for DCP01 series |
| Chip thickness |
0.4 mm |
| Reflective side |
Au |
| Spring number |
1 rectangular |
| Aspect ratio |
3:1 |
| Cone angle j |
<=22° |
| Curvature radius of a tip |
typical 100 nm |
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| Available Cantilever series |
Cantilever length, L±5µm |
Cantilever width, W±3µm |
Cantilever thickness, µm |
Resonant frequency, kHz |
Force constant, N/m |
| min |
typical |
max |
min |
typical |
max |
min |
typical |
max |
| DCP01 |
130 |
35 |
1.7 |
2.0 |
2.3 |
115 |
150 |
190 |
2.5 |
5.5 |
10 |
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